Ceva Launches NeuPro NPU Portfolio To Deliver Up To 2x Higher AI Throughput Per mm² And 50% Improvement In Energy Efficiency
Built on a common architecture and unified software stack, the new portfolio is designed to support increasingly demanding multimodal, generative and agentic AI workloads across Physical AI applications, from always-on
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Why It Matters
Ceva made new AI chips that do more work using less power. This shows the company is keeping up with AI demands and competition.
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Source: Benzinga · Read the original report at the publisher. Headline and figures shown for context; data may be delayed.
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