ACM Research Announces Shipment Of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production System To Customer In Asia Outside Mainland China
ACM Research, Inc. ("ACM") (NASDAQ:ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP
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Why It Matters
ACM Research shipped its first big new electroplating machine to Asia. This shows the company can make and deliver advanced equipment, which hints at real customer demand.
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