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NVIDIA And Amkor Plan To Expand Advanced Packaging Capacity In South Korea, Targeting Greater Than 300% Increase In Interposer Wafer Capacity By End Of 2028

Oct 21, 2026 · 06:40 AM ET· updated 2h ago

Scaling Advanced Packaging for Next-Generation PlatformsNVIDIA and Amkor plan to expand advanced packaging capacity in South Korea, targeting a greater than 300% increase in interposer wafer capacity by the end of 2028.

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Why It Matters

NVIDIA and Amkor are building more factories in South Korea to make computer chips faster. When companies spend big money on factories, it usually means they expect lots of demand ahead.

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Source: Benzinga · Read the original report at the publisher. Headline and figures shown for context; data may be delayed.

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