GlobalFoundries Reaches Deal With TSMC To Create U.S.-Based Supply Of Silicon Interposers For TSMC's CoWoS Advanced Packaging Ecosystem
GlobalFoundries (NASDAQ:GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS® advanced packaging ecosystem. Under the agreement, GF
GlobalFoundries will make computer chip parts for TSMC in the United States. This shows big chip companies want to build more factories here instead of overseas.
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Source: Benzinga · Read the original report at the publisher. Headline and figures shown for context; data may be delayed.
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