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GlobalFoundries Reaches Deal With TSMC To Create U.S.-Based Supply Of Silicon Interposers For TSMC's CoWoS Advanced Packaging Ecosystem

Oct 8, 2026 · 08:14 AM ET· updated 2h ago

GlobalFoundries (NASDAQ:GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS® advanced packaging ecosystem. Under the agreement, GF

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Why It Matters

GlobalFoundries will make computer chip parts for TSMC in the United States. This shows big chip companies want to build more factories here instead of overseas.

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Source: Benzinga · Read the original report at the publisher. Headline and figures shown for context; data may be delayed.

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