Samsung, Broadcom Ink $200 Billion AI Chip Pact Through 2030 as Foundry Race With TSMC Heats Up
Samsung and Broadcom signed a partnership projected above $200 billion to advance AI chips, memory and semiconductor manufacturing.
Samsung and Broadcom made a big deal to work together on AI chips for the next several years. This shows Samsung is trying hard to compete with other chip makers, so watch whether they actually deliver the new technology they promised.
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Source: Benzinga · Read the original report at the publisher. Headline and figures shown for context; data may be delayed.
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